Wafer-level flame-spray-pyrolysis deposition of gas-sensitive layers on microsensors
This paper presents a CMOS-compatible wafer-level fabrication process for monolithic CMOS/MEMS sensor systems coated with sensitive layers directly deposited by means of flame spray pyrolysis (FSP). Microhotplate (νHP)-based devices, featuring an FSP dir
|Collections||ANU Research Publications|
|Source:||Journal of Micromechanics and Microengineering|
|01_Kuhne_Wafer-level_2008.pdf||2.27 MB||Adobe PDF||Request a copy|
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