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Wafer-level flame-spray-pyrolysis deposition of gas-sensitive layers on microsensors

Kuhne, S; Graf, M; Tricoli, Antonio; Mayer, F; Pratsinis, S.E; Hierlemann, A

Description

This paper presents a CMOS-compatible wafer-level fabrication process for monolithic CMOS/MEMS sensor systems coated with sensitive layers directly deposited by means of flame spray pyrolysis (FSP). Microhotplate (νHP)-based devices, featuring an FSP dir

CollectionsANU Research Publications
Date published: 2008
Type: Journal article
URI: http://hdl.handle.net/1885/23165
Source: Journal of Micromechanics and Microengineering
DOI: 10.1088/0960-1317/18/3/035040

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