Wafer-level flame-spray-pyrolysis deposition of gas-sensitive layers on microsensors

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dc.contributor.authorKuhne, S
dc.contributor.authorGraf, M
dc.contributor.authorTricoli, Antonio
dc.contributor.authorMayer, F
dc.contributor.authorPratsinis, S.E
dc.contributor.authorHierlemann, A
dc.date.accessioned2015-12-07T22:33:14Z
dc.date.issued2008
dc.date.updated2015-12-07T10:29:01Z
dc.description.abstractThis paper presents a CMOS-compatible wafer-level fabrication process for monolithic CMOS/MEMS sensor systems coated with sensitive layers directly deposited by means of flame spray pyrolysis (FSP). Microhotplate (νHP)-based devices, featuring an FSP dir
dc.identifier.issn0960-1317
dc.identifier.urihttp://hdl.handle.net/1885/23165
dc.publisherIOP Publishing
dc.sourceJournal of Micromechanics and Microengineering
dc.subjectKeywords: CMOS integrated circuits; Heat resistance; Microsensors; Pyrolysis; FSP directly; Microhotplate; Thermal characterization; Flame research
dc.titleWafer-level flame-spray-pyrolysis deposition of gas-sensitive layers on microsensors
dc.typeJournal article
local.bibliographicCitation.issue3
local.bibliographicCitation.startpage035040
local.contributor.affiliationKuhne, S, Swiss Federal Institute of Technology Zurich (ETH Zurich)
local.contributor.affiliationGraf, M, Sensirion AG
local.contributor.affiliationTricoli, Antonio, College of Engineering and Computer Science, ANU
local.contributor.affiliationMayer, F, Sensirion AG
local.contributor.affiliationPratsinis, S.E, Swiss Federal Institute of Technology Zurich (ETH Zurich)
local.contributor.affiliationHierlemann, A, Swiss Federal Institute of Technology Zurich (ETH Zurich)
local.contributor.authoruidTricoli, Antonio, u5276175
local.description.embargo2037-12-31
local.description.notesImported from ARIES
local.identifier.absfor091205 - Functional Materials
local.identifier.absfor100706 - Nanofabrication, Growth and Self Assembly
local.identifier.absseo899999 - Information and Communication Services not elsewhere classified
local.identifier.ariespublicationu4628727xPUB25
local.identifier.citationvolume18
local.identifier.doi10.1088/0960-1317/18/3/035040
local.identifier.scopusID2-s2.0-42549134936
local.identifier.thomsonID000254151600040
local.type.statusPublished Version

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