Formation of ordered arrays of gold particles on silicon and silicon-dioxide by nanoindentation patterning
Date
2010
Authors
Ruffell, Simon
Venkatachalam, Dinesh
Shalav, Avi
Elliman, Robert
Journal Title
Journal ISSN
Volume Title
Publisher
Materials Research Society
Abstract
Ordered arrays of gold particles have been fabricated on gold-coated Si(100) surfaces by pre-patterning the surface with a nanoindenter. During thermal annealing the Au is observed to accumulate within the residual indents. Once nucleated, the Au particles grow at the expense of smaller surface particles via an Ostwald-ripening process. The size of the Au particles is controlled by the initial thickness of the deposited Au layer, the size of the indentation (which is controlled with a high degree of precision), and the annealing conditions. Particles of ∼200 nm dimensions are formed in indents of ∼1 μm dimensions whilst nanoparticles of ∼20 nm are observed in the smallest indents made (∼50 nm). We have also demonstrated patterning of Au by indentation of a Au layer sandwiched between two SiO2 films deposited on Si by plasma-enhanced chemical vapour deposition. Here, cracking of the SiO2 layer occurs allowing Au to diffuse to the surface at the indented locations during post-indentation annealing.
Description
Keywords
Keywords: Annealing condition; Au particles; Degree of precision; Gold particles; Gold-coated; Initial thickness; Nanoindenters; Ordered array; Plasma-enhanced chemical vapour depositions; Pre-patterning; Residual indent; Ripening process; Si(100) surface; Silicon
Citation
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Source
Materials Research Society Symposium Proceedings Volume 1228
Type
Conference paper