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Chemistry of Cu deposition by Cu(hfac)(tmvs) monitored by Li⁺ ion attachment mass spectrometry

Fujii, Toshihiro; Arulmozhiraja, Sundaram; Nakamura, Megumi; Shiokawa, Yoshiro

Description

Ion attachment mass spectrometry was used for continuous in situanalysis of coordinated products formed during copperchemical vapor deposition(CuCVD) by Cu(1,1,1,5,5,5-hexafluoroacetylacetonate)(vinyltrimethylsilane) [Cu(hfac)(tmvs)] in a simple tubular reactor. This study of the thermally labile Cu(hfac)(tmvs) demonstrated the utility of this method for detecting molecular ions of labile compounds. The results demonstrate the feasibility of monitoring the deposition chemistry of Cu(hfac)(tmvs)...[Show more]

dc.contributor.authorFujii, Toshihiro
dc.contributor.authorArulmozhiraja, Sundaram
dc.contributor.authorNakamura, Megumi
dc.contributor.authorShiokawa, Yoshiro
dc.date.accessioned2015-11-27T04:55:03Z
dc.date.available2015-11-27T04:55:03Z
dc.identifier.issn0021-8979
dc.identifier.urihttp://hdl.handle.net/1885/16887
dc.description.abstractIon attachment mass spectrometry was used for continuous in situanalysis of coordinated products formed during copperchemical vapor deposition(CuCVD) by Cu(1,1,1,5,5,5-hexafluoroacetylacetonate)(vinyltrimethylsilane) [Cu(hfac)(tmvs)] in a simple tubular reactor. This study of the thermally labile Cu(hfac)(tmvs) demonstrated the utility of this method for detecting molecular ions of labile compounds. The results demonstrate the feasibility of monitoring the deposition chemistry of Cu(hfac)(tmvs) by generating Li⁺ adduct molecular ions by means of the Li⁺ ion attachment technique. The reaction pathways for CuCVD by Cu(hfac)(tmvs) were studied by analysis of the reaction products. H(hfac) and tmvs were identified as the main products when Cu(hfac)tmvs was heated at temperatures ranging from room temperature to 160°C in the reactor. The rate constant for Cu deposition, k (1/s), was determined to be 1.6×10⁶exp(−10.2kcal/molRt).
dc.description.sponsorshipThis work was supported in part by The New Energy and Industrial Technology Development Organization NEDO under a fund for Fundamental Technology Research Facilitation Program.
dc.publisherAmerican Institute of Physics (AIP)
dc.rightshttp://www.sherpa.ac.uk/romeo/issn/0021-8979..."Publishers version/PDF may be used on author's personal website, institutional website or institutional repository" from SHERPA/RoMEO site (as at 27/11/15). Copyright 2006 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. The following article appeared in Journal of Applied Physics and may be found at https://doi.org/10.1063/1.2360768
dc.sourceJournal of Applied Physics
dc.titleChemistry of Cu deposition by Cu(hfac)(tmvs) monitored by Li⁺ ion attachment mass spectrometry
dc.typeJournal article
local.description.notesImported from ARIES. At the time of publication the author Arulmozhiraja was affiliated with Environmental Chemistry Division, National Institute for Environmental Studies, Japan
local.identifier.citationvolume100
dc.date.issued2006-10-31
local.identifier.absfor030701
local.identifier.ariespublicationU4217927xPUB656
local.publisher.urlhttps://www.aip.org/
local.type.statusPublished Version
local.contributor.affiliationFujii, Toshihiro, Meisei University, Japan
local.contributor.affiliationArulmozhiraja, Sundaram, College of Physical and Mathematical Sciences, CPMS Research School of Chemistry, RSC General, The Australian National University
local.contributor.affiliationNakamura, Megumi, Canon Anelva Texnix Corporation, Japan
local.contributor.affiliationShiokawa, Yoshiro, Canon Anelva Texnix Corporation, Japan
local.bibliographicCitation.issue8
local.bibliographicCitation.startpage084912
local.identifier.doi10.1063/1.2360768
CollectionsANU Research Publications

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