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Redistribution of Boron in Silicon after Ne+ Postirradiation and Thermal Annealing

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Authors

Fink, Dietmar
Szimkowiak, P
Hu, Xiao-Zhi
Ho, Joshua
Vacik, J
Chadderton, Lewis

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Gordon and Breach

Abstract

Silicon wafers were implanted with 200 keV B+ ions up to 5 × 1014 cm-2 fluence, then postirradiated with 75-650 keV Ne+ ions at different fluences up to a near-constant damage level, and finally furnace annealed up to 500°C. The change in the boron dept

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Source

Radiation Effects and Defects in Solids

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2037-12-31
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