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Intermetallic phase transformations in Au-Al wire bonds

Date

Authors

Xu, H

Liu, C

Silberschmidt, V V

Pramana, Stevin S

White, Timothy

Chen, Z

Acoff, V L

Publisher

Elsevier

Abstract

This paper describes the crystallochemical mechanisms that underpin the migration of nano-size alumina, intermetallic growth and phase transformations in Au-Al wire bonds during annealing from 175 °C to 250 °C by utilizing high-resolution transmission e

Keywords

Keywords: Aluminides; Au-Al wire bond; B. Phase transformation; C. Wire bonding; Intermetallic growth; Intermetallic phase; Nano-size; Phase development; Third phase; Alumina; Annealing; Electronics packaging; High resolution transmission electron microscopy; Inter A. Aluminides; B. Phase transformation; C. Wire bonding; D. Microstructure; F. Electron microscopy

URI

http://hdl.handle.net/1885/58042

Collections

ANU Research Publications

Source

Intermetallics

Type

Journal article

DOI

10.1016/j.intermet.2011.07.003

Restricted until

2037-12-31

Downloads

File

Description

01_Xu_Intermetallic_phase_2011.pdf (2.68 MB)