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Thermal shrinkage and stability of diamondene nanotubes

dc.contributor.authorWang, Lei
dc.contributor.authorCai, Kun
dc.contributor.authorXie, Yi Min
dc.contributor.authorQin, Qinghua
dc.date.accessioned2024-05-08T01:23:30Z
dc.date.issued2019
dc.date.updated2023-01-08T07:17:25Z
dc.description.abstractBy curving a rectangular diamondene, an sp 2/sp 3 composite carbon film, a diamondene nanotube (DNT) can be formed when the two straight edges are sewn together. In this study, thermal stabilities of DNTs are investigated using molecular dynamics simulation approaches. An interesting thermal shrinkage of damaged DNTs is discovered. Results indicate that DNTs have critical temperatures between 320 K and 350 K. At temperatures higher than the critical value, the interlayer bonds, i.e., the sp 3–sp 3 bonds, may break. The broken ratio of the interlayer bonds mainly depends on the temperature. For the DNT with a high broken ratio of interlayer bonds, it has thermal shrinkage in both the cross section and tube axis. The sp 2–sp 3 bonds in either the inner or the outer surface are much more stable. Even at 900 K, only a few sp 2–sp 3 bonds break. These properties can be used in the design of metamaterials.en_AU
dc.description.sponsorshipThis work is financially supported by the National Natural Science Foundation, China (Grant No. 11472098), and the National Key Research and Development Plan, China (Grant No. 2017YFC0405102).en_AU
dc.format.mimetypeapplication/pdfen_AU
dc.identifier.issn0957-4484en_AU
dc.identifier.urihttp://hdl.handle.net/1885/317353
dc.language.isoen_AUen_AU
dc.publisherInstitute of Physics Publishingen_AU
dc.rights© 2018 IOP Publishing Ltden_AU
dc.sourceNanotechnologyen_AU
dc.subjectdiamondeneen_AU
dc.subjectnanotubeen_AU
dc.subjectthermal shrinkageen_AU
dc.subjectthermal stabilityen_AU
dc.subjectmolecular dynamicsen_AU
dc.titleThermal shrinkage and stability of diamondene nanotubesen_AU
dc.typeJournal articleen_AU
local.bibliographicCitation.issue7en_AU
local.bibliographicCitation.lastpage12en_AU
local.bibliographicCitation.startpage1en_AU
local.contributor.affiliationWang, Lei, Hohai Universityen_AU
local.contributor.affiliationCai, Kun, RMIT Universityen_AU
local.contributor.affiliationXie, Yi Min, RMIT Universityen_AU
local.contributor.affiliationQin, Qinghua, College of Engineering, Computing and Cybernetics, ANUen_AU
local.contributor.authoruidQin, Qinghua, u4119044en_AU
local.description.embargo2099-12-31
local.description.notesImported from ARIESen_AU
local.identifier.absfor401600 - Materials engineeringen_AU
local.identifier.ariespublicationu3102795xPUB552en_AU
local.identifier.citationvolume30en_AU
local.identifier.doi10.1088/1361-6528/aaf3e7en_AU
local.identifier.scopusID2-s2.0-85058913144
local.identifier.thomsonIDWOS:000453845900001
local.publisher.urlhttps://iopscience.iop.org/en_AU
local.type.statusPublished Versionen_AU

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