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Introduction of TiO₂ in CuI for Its Improved Performance as a p-Type Transparent Conductor

dc.contributor.authorRaj, Vidur
dc.contributor.authorLu, Teng
dc.contributor.authorLockrey, Mark
dc.contributor.authorLiu, Rong
dc.contributor.authorKremer, Felipe
dc.contributor.authorLi, Li
dc.contributor.authorLiu, Yun
dc.contributor.authorTan, Hark Hoe
dc.contributor.authorJagadish, Chennupati
dc.date.accessioned2019-08-19T03:43:09Z
dc.date.issued2019-07-10
dc.description.abstractThe challenges of making high-performance, low-temperature processed, p-type transparent conductors (TCs) have been the main bottleneck for the development of flexible transparent electronics. Though a few p-type transparent conducting oxides (TCOs) have shown promising results, they need high processing temperature to achieve the required conductivity which makes them unsuitable for organic and flexible electronic applications. Copper iodide is a wide band gap p-type semiconductor that can be heavily doped at low temperature (<100 °C) to achieve conductivity comparable or higher than many of the well-established p-type TCOs. However, as-processed CuI loses its transparency and conductivity with time in an ambient condition which makes them unsuitable for long-term applications. Herein, we propose CuI-TiO2 composite thin films as a replacement of pure CuI. We show that the introduction of TiO2 in CuI makes it more stable in ambient conditions while also improving its conductivity and transparency. A detailed comparative analysis between CuI and CuI-TiO2 composite thin films has been performed to understand the reasons for improved conductivity, transparency, and stability of CuI-TiO2 samples in comparison to pure CuI samples. The enhanced conductivity in CuI-TiO2 stems from the highly conductive space-charge layer formation at the CuI-TiO2 interface, whereas the improved transparency is due to reduced CuI grain growth mobility in the presence of TiO2. The improved stability of CuI-TiO2 in comparison to pure CuI is a result of inhibited recrystallization and grain growth, reduced loss of iodine, and limited oxidation of the CuI phase in the presence of TiO2. For optimized fraction of TiO2, an average transparency of ∼78% (in 450-800 nm region) and a resistivity of 14 mΩ·cm are achieved, while maintaining a relatively high mobility of ∼3.5 cm2 V-1 s-1 with hole concentration reaching as high as 1.3 × 1020 cm-3. Most importantly, this work opens up the possibility to design a new range of p-type transparent conducting materials using the CuI/insulator composite system such as CuI/SiO2, CuI/Al2O3, CuI/SiN x, and so forth.en_AU
dc.description.sponsorshipThis research is supported by the Australian Research Council. The Australian National Fabrication Facility (ANFF) and Australian Microscopy and Microanalysis Research Facility (AMMRF) is gratefully acknowledged for providing access to the fabrication and microscopy facilities used in this work. Y.L. and T.L. thanks the financial support from Australian Research Council in the form of discovery project (DP160104780).en_AU
dc.format.mimetypeapplication/pdfen_AU
dc.identifier.issn1944-8244en_AU
dc.identifier.urihttp://hdl.handle.net/1885/165134
dc.language.isoen_AUen_AU
dc.provenancehttp://sherpa.ac.uk/romeo/issn/1944-8244/..."can archive post-print (ie final draft post-refereeing) If mandated by funding agency or employer/ institution" from SHERPA/RoMEO site (as at 19/08/19).en_AU
dc.publisherAmerican Chemical Societyen_AU
dc.relationhttp://purl.org/au-research/grants/arc/DP160104780en_AU
dc.rights© 2019 American Chemical Societyen_AU
dc.sourceACS applied materials and interfacesen_AU
dc.subjectcui fermi levelen_AU
dc.subjectcui stabilityen_AU
dc.subjectconductivity effects at interfacesen_AU
dc.subjectcopper iodide (cui)en_AU
dc.subjecthalide-oxide interfaceen_AU
dc.subjectp-type transparent conductoren_AU
dc.titleIntroduction of TiO₂ in CuI for Its Improved Performance as a p-Type Transparent Conductoren_AU
dc.typeJournal articleen_AU
dcterms.accessRightsOpen Accessen_AU
local.bibliographicCitation.issue27en_AU
local.bibliographicCitation.lastpage24263en_AU
local.bibliographicCitation.startpage24254en_AU
local.contributor.affiliationRaj, V., Research School of Physics and Engineering, The Australian National Universityen_AU
local.contributor.affiliationTan, H. H., Research School of Physics and Engineering, The Australian National Universityen_AU
local.contributor.affiliationJagadish, C., Research School of Physics and Engineering, The Australian National Universityen_AU
local.contributor.affiliationLu, Teng, Research School of Chemistry, The Australian National Universityen_AU
local.contributor.affiliationLiu, Yun, Research School of Chemistry, The Australian National Universityen_AU
local.contributor.authoruidu5858523en_AU
local.identifier.ariespublicationu3102795xPUB4397
local.identifier.citationvolume11en_AU
local.identifier.doi10.1021/acsami.9b05566en_AU
local.identifier.essn1944-8252en_AU
local.publisher.urlhttps://pubs.acs.org/en_AU
local.type.statusAccepted Versionen_AU

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