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Protective capping and surface passivation of III-V nanowires by atomic layer deposition

dc.contributor.authorDhaka, Veer
dc.contributor.authorPerros, Alexander
dc.contributor.authorNaureen, Shagufta
dc.contributor.authorShahid, Naeem
dc.contributor.authorJiang, Hua
dc.contributor.authorKakko, Joona-Pekko
dc.contributor.authorHaggren, Tuomas
dc.contributor.authorKauppinen, Esko
dc.contributor.authorSrinivasan, Anand
dc.contributor.authorLipsanen, Harri
dc.date.accessioned2016-06-14T23:20:58Z
dc.date.issued2016
dc.date.updated2016-06-14T08:54:40Z
dc.description.abstractLow temperature (∼200 ◦C) grown atomic layer deposition (ALD) films of AlN, TiN, Al2O3, GaN, and TiO2 were tested for protective capping and surface passivation of bottom-up grown III-V (GaAs and InP) nanowires (NWs), and top-down fabricated InP nanopillars. For as-grown GaAs NWs, only the AlN material passivated the GaAs surface as measured by photoluminescence (PL) at low temperatures (15K), and the best passivation was achieved with a few monolayer thick (2Å) film. For InP NWs, the best passivation (∼2x enhancement in room-temperature PL) was achieved with a capping of 2nm thick Al2O3. All other ALD capping layers resulted in a de-passivation effect and possible damage to the InP surface. Top-down fabricatedInP nanopillars show similar passivation effects as InP NWs. In particular, capping with a 2 nm thick Al2O3 layer increased the carrier decay time from 251 ps (as-etched nanopillars) to about 525 ps. Tests after six months ageing reveal that the capped nanostructures retain their optical properties. Overall, capping of GaAs and InP NWs with high-k dielectrics AlN and Al2O3 provides moderate surface passivation as well as long term protection from oxidation and environmental attack.
dc.identifier.issn2158-3226
dc.identifier.urihttp://hdl.handle.net/1885/103644
dc.publisherAmerican Institute of Physics (AIP)
dc.rightsAuthor/s retain copyrighten_AU
dc.sourceAIP Advances
dc.titleProtective capping and surface passivation of III-V nanowires by atomic layer deposition
dc.typeJournal article
dcterms.accessRightsOpen Accessen_AU
local.bibliographicCitation.issue1
local.bibliographicCitation.lastpage7
local.bibliographicCitation.startpage1
local.contributor.affiliationDhaka, Veer, Aalto University
local.contributor.affiliationPerros, Alexander, Aalto University
local.contributor.affiliationNaureen, Shagufta, College of Physical and Mathematical Sciences, ANU
local.contributor.affiliationShahid, Naeem, College of Physical and Mathematical Sciences, ANU
local.contributor.affiliationJiang, Hua, Aalto University
local.contributor.affiliationKakko, Joona-Pekko, Aalto University
local.contributor.affiliationHaggren, Tuomas, Aalto University
local.contributor.affiliationKauppinen, Esko, Aalto University
local.contributor.affiliationSrinivasan, Anand, KTH Royal Institute of Technology
local.contributor.affiliationLipsanen, Harri, Aalto University
local.contributor.authoruidNaureen, Shagufta, u5447495
local.contributor.authoruidShahid, Naeem, u5312347
local.description.notesImported from ARIES
local.identifier.absfor020404 - Electronic and Magnetic Properties of Condensed Matter; Superconductivity
local.identifier.absfor091203 - Compound Semiconductors
local.identifier.absfor100706 - Nanofabrication, Growth and Self Assembly
local.identifier.ariespublicationU3488905xPUB9037
local.identifier.citationvolume6
local.identifier.doi10.1063/1.4941063
local.identifier.scopusID2-s2.0-84956702878
local.type.statusPublished Version

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