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A theoretical model for surface bone remodeling under electromagnetic loads

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dc.contributor.authorHe, X.Q.
dc.contributor.authorQu, Chuan-Yong
dc.contributor.authorQin, Qing Hua
dc.date.accessioned2015-12-07T22:33:24Z
dc.date.issued2008
dc.date.updated2015-12-07T10:30:59Z
dc.description.abstractA theoretical model for surface bone remodeling under electromagnetic loads is proposed in this paper. In the model, surface bone remodeling is assumed to be related to growth factors. Growth factors in latent form in osteocytes are released to the bone fluid after the osteocytes are absorbed by osteoclasts, and then regulate the bone formation process. At the same time, environmental loadings can influence the generation of growth factors. This paper shows how surface bone remodeling is triggered under the influence of growth factors. Based on this hypothesis, a computational model is established that simulates the bone coupling remodeling process, including internal and surface bone remodeling. The effects of various loadings, including electrical and magnetic loadings, are simulated and compared. The interactions between internal and surface bone remodeling are investigated via the numerical method. The results indicate that an electromagnetic field can strongly influence the bone remodeling process and that the remodeling process will be altered after surface bone remodeling is triggered, compared to the sole effect of the internal remodeling process.
dc.identifier.issn0939-1533
dc.identifier.urihttp://hdl.handle.net/1885/23250
dc.publisherSpringer
dc.sourceArchive of Applied Mechanics
dc.subjectKeywords: Biomaterials; Biomechanics; Computer simulation; Electromagnetic field effects; Surface phenomena; Bone fluid; Bone remodeling; Growth factors; Magnetic loadings; Bone Biomaterials; Biomechanics; Bone remodeling; Electromagnetic field
dc.titleA theoretical model for surface bone remodeling under electromagnetic loads
dc.typeJournal article
local.bibliographicCitation.issue3(2008)
local.bibliographicCitation.startpage163 to 175
local.contributor.affiliationHe, X.Q., City University of Hong Kong
local.contributor.affiliationQu, Chuan-Yong, Tianjin University
local.contributor.affiliationQin, Qing Hua, College of Engineering and Computer Science, ANU
local.contributor.authoruidQin, Qing Hua, u4119044
local.description.embargo2037-12-31
local.description.notesImported from ARIES
local.identifier.absfor090699 - Electrical and Electronic Engineering not elsewhere classified
local.identifier.ariespublicationu9606031xPUB25
local.identifier.citationvolume78
local.identifier.doi10.1007/s00419-007-0144-y
local.identifier.scopusID2-s2.0-38549083180
local.identifier.thomsonID000252473700001
local.type.statusPublished Version

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