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A Model of Plasma-Based Ion Implantation Around a Round Hole in a Flat Plate

dc.contributor.authorSheridan, T
dc.date.accessioned2015-12-13T23:34:34Z
dc.date.available2015-12-13T23:34:34Z
dc.date.issued1999
dc.date.updated2015-12-12T09:36:30Z
dc.description.abstractWe use a two-dimensional hybrid simulation (particle ions and Boltzmann electrons) to study sheath and ion dynamics around a small round hole in a flat, conducting plate following the application of a large, negative voltage pulse, such as might be encountered during plasma-based ion implantation. Results for hole radii of an eighth and half the ion-matrix overlap length and for depths of one, two and four times the radius are reported. For all these cases, it is found that the hole represents a small perturbation to a planar sheath since the sheath width is always greater than the hole radius. Consequently, most of the ions that enter the hole impact on its bottom at near normal angles; only a small fraction impact on the sidewall obliquely.
dc.identifier.issn0022-3727
dc.identifier.urihttp://hdl.handle.net/1885/93501
dc.publisherInstitute of Physics Publishing
dc.sourceJournal of Physics D: Applied Physics
dc.subjectKeywords: Computer simulation; Electric potential; Electrons; Plasma applications; Plasma sheaths; Positive ions; Surface treatment; Two dimensional; Boltzmann electrons; Ion dynamics; Ion matrix overlap length; Plasma based ion implantation; Ion implantation
dc.titleA Model of Plasma-Based Ion Implantation Around a Round Hole in a Flat Plate
dc.typeJournal article
local.bibliographicCitation.lastpage890
local.bibliographicCitation.startpage886
local.contributor.affiliationSheridan, T, College of Physical and Mathematical Sciences, ANU
local.contributor.authoruidSheridan, T, u3201819
local.description.notesImported from ARIES
local.description.refereedYes
local.identifier.absfor020204 - Plasma Physics; Fusion Plasmas; Electrical Discharges
local.identifier.ariespublicationMigratedxPub24863
local.identifier.citationvolume32
local.identifier.doi10.1088/0022-3727/32/8/008
local.identifier.scopusID2-s2.0-0345476806
local.type.statusPublished Version

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