Stress and Stress Relief in Dielectric Thin Films - The Role of Hydrogen
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Elliman, Robert
Dall (previously Weijers), Tessica
Spooner, M G
Kim, Tae-Hyun
Wilkinson, Andrew
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Elsevier
Abstract
Novel crack propagation modes are reported in amorphous silicon-rich oxide (SiOx) films deposited onto (1 0 0) silicon substrates and subjected to thermal annealing. These include the formation of straight cracks aligned with 〈0 0 1〉 directions in the
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Nuclear Instruments and Methods in Physics Research: Section B
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Restricted until
2037-12-31
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