Method of analyzing silicon groove damage using QSS-PC, PL imaging, silicon etch rate, and visual microscopy for solar cell fabrication
This work uses a variety of tools to investigate damage caused by laser and dicing saw grooving in silicon. The tools comprise quasi steady state photoconductance decay, photoluminescence imaging, measurement of silicon etch rate in anisotropic etch solution, and visual microscopy. Shallow grooves were formed using a 532 nm Q-switched Nd:YLF frequency doubled solid state laser and a high speed spindle dicing saw. Combined analysis of the characterization tools enabled determination of the...[Show more]
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|Source:||Progress in Photovoltaics: Research and Applications|
|01_Fong_Method_of_analyzing_silicon_2011.pdf||1.43 MB||Adobe PDF||Request a copy|
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