A Numerical Method for Analysing Heat Conduction in Composites Containing Encapsulated Phase Change Materials

dc.contributor.authorWang, Huien
dc.contributor.authorQin, Qing Huaen
dc.date.accessioned2025-06-29T16:33:28Z
dc.date.available2025-06-29T16:33:28Z
dc.date.issued2018-11-26en
dc.description.abstractIn this study, a three-dimensional transient heat transfer model in a three-phase composite system is established to investigate effects of temperature reduction in a composite system due to the use of encapsulated phase change material (PCM). The entire composite system is composed of cement matrix material, PCM, and hollow metal microspheres (HMSs) which are introduced to accelerate the phase change efficiency of the PCM and to simultaneously hold the liquid phase of the PCM. The present transient heat transfer model is numerically solved via finite element technique for investigating the transient thermal performance of the three-phase composite system. The temperature distribution on the specific area is compared to that in the pure cement material and the two-phase composite system without metal shell for demonstrating the ability of temperature adjustment of the PCM. Finally, effects of the spatial distribution of HMS on the temperature variation in the three-phase composite system is further investigated to provide comprehensive understanding on energy adjustment of this composite system.en
dc.description.statusPeer-revieweden
dc.identifier.scopus85058713887en
dc.identifier.urihttp://www.scopus.com/inward/record.url?scp=85058713887&partnerID=8YFLogxKen
dc.identifier.urihttps://hdl.handle.net/1885/733765331
dc.language.isoenen
dc.relation.ispartofseries3rd International Conference on Design, Mechanical and Material Engineering, D2ME 2018en
dc.rightsPublisher Copyright: © 2018 The Authors, published by EDP Sciences.en
dc.sourceMATEC Web of Conferencesen
dc.titleA Numerical Method for Analysing Heat Conduction in Composites Containing Encapsulated Phase Change Materialsen
dc.typeConference paperen
dspace.entity.typePublicationen
local.contributor.affiliationWang, Hui; Henan University of Technologyen
local.contributor.affiliationQin, Qing Hua; School of Engineering, ANU College of Systems and Society, The Australian National Universityen
local.identifier.ariespublicationu3102795xPUB191en
local.identifier.citationvolume237en
local.identifier.doi10.1051/matecconf/201823702012en
local.identifier.pure9b882753-b5f0-429b-86e9-50f65c3452ceen
local.identifier.urlhttps://www.scopus.com/pages/publications/85058713887en
local.type.statusPublisheden

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