Structural and Electrical Properties of In and C + In implanted Ge, Si, and Si₁ˍₓGeₓ
Abstract
It is widely accepted that when transistors are scaled beyond the
10-nm technology generation in the near future, Ge, or
alternatively Si1-xGex will potentially replace Si as the channel
material to maintain CMOS device performance improvement. In is
one of the most promising p-type dopant in Ge and Si1-xGex.
Hence, this thesis has contributed to the field of semiconductors
by performing systematic studies on the structural and electrical
properties of In doped and C + In co-doped Ge, Si, and Si1-xGex.
In (and C) atoms were incorporated into Si, Si0.35Ge0.65,
Si0.1Ge0.9, and Ge thin films by ion implantation. Electrical
properties of the implanted samples were determined by Hall
effect measurement, while the identification of the sample
structural properties was performed using TEM, Raman
spectroscopy, DFT calculation, and X-ray absorption spectroscopy.
The dopant concentration effects on the structural and electrical
properties of In-implanted Ge were investigated. For In
concentrations lower than 0.2 atomic percent, all In atoms occupy
a substitutional lattice site. The formation of metallic In
precipitates and In-vacancy complexes are apparent for In
concentrations greater than 0.6 atomic percent. Electrical
measurement results were correlated with the determined
structural properties.
Aiming to enhance the electrical activation of In in Ge, C was
introduced as a co-dopant with In. With C + In co-doping, the
electrically active fraction was significantly enhanced. This
dramatic improvement was found to be the result of C-In pair
formation such that In-induced strain in the Ge lattice was
reduced while the precipitation of In and the formation of
In-vacancy clusters were both suppressed.
Si1-xGex alloys have the potential to combine the positive
aspects of Si and Ge as the substrate for In doping. Thus, we
performed a systematic study on the dopant concentration and
substrate stoichiometry effects on the electrical and structural
properties of In-implanted Si1-xGex (including Si and Ge).
Correlating the fraction of electrically-active In atoms and the
In atomic environment, we observed the transition from
electrically-active, substitutional In at low In concentration to
electrically-inactive metallic In at high In concentration. The
In solid-solubility limit has been quantified, which was found
increased as the Ge fraction of the Si1-xGex alloy increased.
Since we found that the Si fraction in Si1-xGex affected its In
solid solubility significantly, an above-equilibrium solid
solubility threshold is needed to maintain a high In electrical
activation. To that end, the co-doping strategy with C was again
employed. With C + In co-doping, the solid solubility of In in
Si0.35Ge0.65 is at least tripled from that of In doped
Si0.35Ge0.65, as a result of C-In pair formation in suppression
of In metal precipitation. Dramatic improvement of the sample
electrical properties was attained.
This thesis demonstrated a promising future for In doped Ge and
Si1-xGex, towards the application to p-type field-effect
transistors in future CMOS devices. C co-doping was verified as
an effective method for enhancing the In solid solubility and
electrical activation in both Ge and Si1-xGex. These results
inspire potential future work like In implantation in
Si1-x-yGexCy.
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