Hattori, HaroldoSeassal, ChristianTouraille, EdouardRojo-Romeo, PedroLetartre, XavierHollinger, GuyViktorovitch, PierreDiCioccio, LeaZussy, MarcEl Melhaoui, LubnaFedeli, Jean-Marc2015-12-071041-1135http://hdl.handle.net/1885/17699A new approach is proposed to realize an optical link for intrachip optical interconnects. This link includes III-V compound-based laser sources and photodctcctors, and silicon-on-insulator-bascd strip waveguides. The heterogeneous integration of an InP-bascd microdisk laser with a silicon waveguide using SiO2-SiO2 molecular bonding and nanofabrication procedures is emphasized. The technological procedure is described and first experimental results show that, with an adequate configuration, 35% of light could be coupled from the optically pumped microlaser to the waveguide, as a result of the vertical evanescent coupling.Keywords: Heterogeneous integration of III-V materials and silicon; Microdisk lasers; Microlasers; Molecular bonding; Integration; Optical interconnects; Optical pumping; Silicon on insulator technology; Waveguides; Semiconductor lasers Heterogeneous integration of III-V materials and silicon; Microdisk lasers; Optical interconnects; Semiconductor lasers200610.1109/LPT.2005.8615422015-12-07