Wafer surface charge reversal as a method of simplifying nanosphere lithography for RIE texturing of solar cells
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Inns, Daniel
Campbell, Patrick
Catchpole, Kylie
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Hindawi Publishing Corporation
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A simplified nanosphere lithography process has been developed which allows fast and low-waste maskings of Si surfaces for subsequent reactive ion etching (RIE) texturing. Initially, a positive surface charge is applied to a wafer surface by dipping in a
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Advances in OptoElectronics
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2037-12-31
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