Dopant effects on the photoluminescence of interstitial-related centers in ion implanted silicon
Date
2012-05-10
Authors
Johnson, B. C.
Villis, B. J.
Burgess, J. E.
Stavrias, N.
McCallum, Jeffrey C.
Charnvanichborikarn, S.
Wong-Leung, Jennifer
Jagadish, C.
Williams, J. S.
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American Institute of Physics (AIP)
Abstract
The dopant dependence of photoluminescence(PL) from interstitial-related centers formed by ion implantation and a subsequent anneal in the range 175–525 °C is presented. The evolution of these centers is strongly effected by interstitial-dopant clustering even in the low temperature regime. There is a significant decrease in the W line (1018.2 meV) PL intensity with increasing B concentration. However, an enhancement is also observed in a narrow fabrication window in samples implanted with either P or Ga. The annealtemperature at which the W line intensity is optimized is sensitive to the dopant concentration and type. Furthermore, dopants which are implanted but not activated prior to low temperature thermal processing are found to have a more detrimental effect on the resulting PL. Splitting of the X line (1039.8 meV) arising from implantation damage induced strain is also observed.
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Keywords
Keywords: Anneal temperatures; Dopant concentrations; Dopant dependence; Dopant effects; Implantation damage; Induced strain; Ion-implanted silicon; Line intensities; Low temperatures; Low-temperature regime; PL intensity; Ion implantation; Photoluminescence; Tempe
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Journal of Applied Physics
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Journal article
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