Thickness-dependent Stress in Plasma-deposited Silicon Dioxide Films
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Au, Vicky
Charles, Christine
Bulla, Douglas
Love, John
Boswell, Roderick
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American Institute of Physics (AIP)
Abstract
Thick silicon dioxide (SiO2) films up to 5 μm have been deposited by helicon activated reactive evaporation (plasma assisted deposition with electron beam evaporation source) as both bilayer and trilayer structures, and the film stress was investigated i
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Journal of Applied Physics