Pulsed chemical vapor deposition of Cu2S into a porous TiO 2 matrix
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Carbone, I.
Zhou, Q.
Vollbrecht, B.
Yang, L.
Medling, Scott
Bezryadina, A.
Bridges, F.
Alers, G.B.
Norman, J.T.
Kinmen, T.
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American Institute of Physics (AIP)
Abstract
Chalcocite (Cu2S) has been deposited via pulsed chemical vapor deposition (PCVD) into a porous TiO2 matrix using hydrogen sulfide and a metal-organic precursor. The precursor used is similar to the more common Cu(hfac)(tmvs) precursor, but it is fluorine
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Journal of Vacuum Science and Technology A
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2037-12-31
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