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Theory and design of compact hybrid microphone arrays on two-dimensional planes for three-dimensional soundfield analysis

Chen, Hanchi; Abhayapala, Thushara; Zhang, Wen

Description

Soundfield analysis based on spherical harmonic decomposition has been widely used in various applications; however, a drawback is the three-dimensional geometry of the microphone arrays. In this paper, a method to design two-dimensional planar microphone arrays that are capable of capturing three-dimensional (3D) spatial soundfields is proposed. Through the utilization of both omni-directional and first order microphones, the proposed microphone array is capable of measuring soundfield...[Show more]

dc.contributor.authorChen, Hanchi
dc.contributor.authorAbhayapala, Thushara
dc.contributor.authorZhang, Wen
dc.date.accessioned2016-02-24T22:41:29Z
dc.identifier.issn0001-4966
dc.identifier.urihttp://hdl.handle.net/1885/98705
dc.description.abstractSoundfield analysis based on spherical harmonic decomposition has been widely used in various applications; however, a drawback is the three-dimensional geometry of the microphone arrays. In this paper, a method to design two-dimensional planar microphone arrays that are capable of capturing three-dimensional (3D) spatial soundfields is proposed. Through the utilization of both omni-directional and first order microphones, the proposed microphone array is capable of measuring soundfield components that are undetectable to conventional planar omni-directional microphone arrays, thus providing the same functionality as 3D arrays designed for the same purpose. Simulations show that the accuracy of the planar microphone array is comparable to traditional spherical microphone arrays. Due to its compact shape, the proposed microphone array greatly increases the feasibility of 3D soundfield analysis techniques in real-world applications.
dc.publisherAcoustical Society of America
dc.rightsAuthor/s retain copyright
dc.sourceJournal of the Acoustical Society of America
dc.titleTheory and design of compact hybrid microphone arrays on two-dimensional planes for three-dimensional soundfield analysis
dc.typeJournal article
local.description.notesImported from ARIES
local.identifier.citationvolume138
dc.date.issued2015
local.identifier.absfor091299 - Materials Engineering not elsewhere classified
local.identifier.absfor099999 - Engineering not elsewhere classified
local.identifier.ariespublicationU3488905xPUB6838
local.type.statusPublished Version
local.contributor.affiliationChen, Hanchi, College of Engineering and Computer Science, ANU
local.contributor.affiliationAbhayapala, Thushara, College of Engineering and Computer Science, ANU
local.contributor.affiliationZhang, Wen, College of Engineering and Computer Science, ANU
dc.relationhttp://purl.org/au-research/grants/arc/DP140103412
local.bibliographicCitation.issue5
local.bibliographicCitation.startpage3081
local.bibliographicCitation.lastpage3092
local.identifier.doi10.1121/1.4934953
dc.date.updated2016-02-24T10:12:16Z
local.identifier.scopusID2-s2.0-84947976118
dcterms.accessRightsOpen Access
dc.provenancehttp://www.sherpa.ac.uk/romeo/issn/0001-4966/..." author can archive publisher's version/PDF. 6 months embargo" from SHERPA/RoMEO site (as at 06/03/19).
CollectionsANU Research Publications

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