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Crystal structure of laser-induced subsurface modifications in Si

Verburg, Peter; Smillie, Lachlan; Romer, G.R.B.E.; Haberl, Bianca; Bradby, Jodie; Williams, James; Veld, A. J. Huis

Description

Laser-induced subsurface modification of dielectric materials is a well-known technology. Applications include the production of optical components and selective etching. In addition to dielectric materials, the subsurface modification technology can be applied to silicon, by employing near to mid-infrared radiation. An application of subsurface modifications in silicon is laser-induced subsurface separation, which is a method to separate wafers into individual dies. Other applications for...[Show more]

CollectionsANU Research Publications
Date published: 2015
Type: Journal article
URI: http://hdl.handle.net/1885/70328
Source: Applied Physics A: Materials Science and Processing
DOI: 10.1007/s00339-015-9238-5

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