Verburg, Peter; Smillie, Lachlan; Romer, G.R.B.E.; Haberl, Bianca; Bradby, Jodie; Williams, James; Veld, A. J. Huis
Laser-induced subsurface modification of dielectric materials is a well-known technology. Applications include the production of optical components and selective etching. In addition to dielectric materials, the subsurface modification technology can be applied to silicon, by employing near to mid-infrared radiation. An application of subsurface modifications in silicon is laser-induced subsurface separation, which is a method to separate wafers into individual dies. Other applications for...[Show more]
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