Evolution of structural, surfacial and mechanical properties of titanium-nickel-copper thin films during rapid thermal annealing
The structural, surfacial and nanoscale mechanical properties evolution of Ti-Ni-Cu thin films, prepared by the co-sputtering of TiNi and Cu targets during rapid thermal annealing (RTA) were investigated. Crystallization took place in a few seconds at 480 °C. With increasing annealing time (up to 180. s), roughness increased dramatically, and was far more prominent than in films crystallized by conventional thermal annealing (CTA). Although RTA is energy efficient due to the lower annealing...[Show more]
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|Source:||Surface and Coatings Technology|
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