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Pulsed chemical vapor deposition of Cu2S into a porous TiO 2 matrix

Carbone, I.; Zhou, Q.; Vollbrecht, B.; Yang, L.; Medling, Scott; Bezryadina, A.; Bridges, F.; Alers, G.B.; Norman, J.T.; Kinmen, T.

Description

Chalcocite (Cu2S) has been deposited via pulsed chemical vapor deposition (PCVD) into a porous TiO2 matrix using hydrogen sulfide and a metal-organic precursor. The precursor used is similar to the more common Cu(hfac)(tmvs) precursor, but it is fluorine

CollectionsANU Research Publications
Date published: 2011
Type: Journal article
URI: http://hdl.handle.net/1885/65155
Source: Journal of Vacuum Science and Technology A
DOI: 10.1116/1.3609772

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