Chemistry of Cu deposition by Cu(hfac)(tmvs) monitored by Li⁺ ion attachment mass spectrometry
Ion attachment mass spectrometry was used for continuous in situanalysis of coordinated products formed during copperchemical vapor deposition(CuCVD) by Cu(1,1,1,5,5,5-hexafluoroacetylacetonate)(vinyltrimethylsilane) [Cu(hfac)(tmvs)] in a simple tubular reactor. This study of the thermally labile Cu(hfac)(tmvs) demonstrated the utility of this method for detecting molecular ions of labile compounds. The results demonstrate the feasibility of monitoring the deposition chemistry of Cu(hfac)(tmvs)...[Show more]
|Collections||ANU Research Publications|
|Source:||Journal of Applied Physics|
|01_Fujii_Chemistry_of_Cu_deposition_by_2006.pdf||83.75 kB||Adobe PDF|
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