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Chemistry of Cu deposition by Cu(hfac)(tmvs) monitored by Li⁺ ion attachment mass spectrometry

Fujii, Toshihiro; Arulmozhiraja, Sundaram; Nakamura, Megumi; Shiokawa, Yoshiro


Ion attachment mass spectrometry was used for continuous in situanalysis of coordinated products formed during copperchemical vapor deposition(CuCVD) by Cu(1,1,1,5,5,5-hexafluoroacetylacetonate)(vinyltrimethylsilane) [Cu(hfac)(tmvs)] in a simple tubular reactor. This study of the thermally labile Cu(hfac)(tmvs) demonstrated the utility of this method for detecting molecular ions of labile compounds. The results demonstrate the feasibility of monitoring the deposition chemistry of Cu(hfac)(tmvs)...[Show more]

CollectionsANU Research Publications
Date published: 2006-10-31
Type: Journal article
Source: Journal of Applied Physics
DOI: 10.1063/1.2360768


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