Suh, Dongchul; Choi, Duk-Yong; Weber, Klaus J.
For silicon surface passivation, we investigate stack layers consisting of a thin Al₂O₃ layer and a TiO₂capping layer deposited by means of thermal atomic layer deposition (ALD). In this work, we studied the influence of different thermal post-deposition treatments and film thickness for the activation of passivating ALD Al₂O₃ single layers and Al₂O₃/TiO₂ stack layers. Our experiments show a substantial improvement of the passivation for the Al₂O₃/TiO₂ stack layers compared to a thin single...[Show more]
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