The study of thermal silicon dioxide electrets formed by corona discharge and rapid-thermal annealing

Abstract

A silicon dioxide (SiO₂) electret passivates the surface of crystalline silicon (Si) in two ways: (i) when annealed and hydrogenated, the SiO₂–Si interface has a low density of interface states, offering few energy levels through which electrons and holes can recombine; and (ii) the electret’s quasipermanent charge repels carriers of the same polarity, preventing most from reaching the SiO₂–Si interface and thereby limiting interface recombination. In this work, we engineer a charged thermal SiO₂electret on Si by depositing corona charge onto the surface of an oxide-coated Si wafer and subjecting the wafer to a rapid thermal anneal (RTA). We show that the surface-located corona charge is redistributed deeper into the oxide by the RTA. With 80 s of charging, and an RTA at 380 °C for 60 s, we measure an electretcharge density of 5 × 10¹² cm⁻², above which no further benefit to surface passivation is attained. The procedure leads to a surface recombination velocity of less than 20 cm/s on 1 Ω-cm n-type Si, which is commensurate with the best passivation schemes employed on high-efficiency Si solar cells. In this paper, we introduce the method of SiO₂electret formation, analyze the relationship between charge density and interface recombination, and assess the redistribution of charge by the RTA.