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A micromechanism study of thermosonic gold wire bonding on aluminum pad

Xu, H.; Liu, C.; Silberschmidt, V. V.; Pramana, S. S.; White, T. J.; Chen, Z.; Sivakumar, M.; Acoff, V. L.

Description

A micromechanism of thermosonic gold wire bonding was elaborated by examining its interfacial characteristics as a result of the bonding process, including the fragmentation of the native aluminum oxide layer on Al pads, and formation of initial intermetallic compounds IMCs. It is found that the existence of an approximately 5 nm thick native oxide layer on original Al pads has a significant effect on the bonding, and the nucleation of IMCs during the bonding process must overcome this...[Show more]

CollectionsANU Research Publications
Date published: 2010
Type: Journal article
URI: http://hdl.handle.net/1885/15497
Source: Journal of Applied Physics
DOI: 10.1063/1.3514005

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