Xu, H.; Liu, C.; Silberschmidt, V. V.; Pramana, S. S.; White, T. J.; Chen, Z.; Sivakumar, M.; Acoff, V. L.
A micromechanism of thermosonic gold wire bonding was elaborated by examining its interfacial
characteristics as a result of the bonding process, including the fragmentation of the native
aluminum oxide layer on Al pads, and formation of initial intermetallic compounds IMCs. It is
found that the existence of an approximately 5 nm thick native oxide layer on original Al pads has
a significant effect on the bonding, and the nucleation of IMCs during the bonding process must
overcome this...[Show more]
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