Pyke, Daniel James
Silicon-on-insulator structures are used for the fabrication of integrated electronic circuits, photonic devices and structures, and micro-electro-mechanical systems. The most common fabrication method for SOI is a hydrogen-induced cleavage technique in which ion-implanted hydrogen is employed to initiate and propagate cracks in a plane parallel to the silicon surface. Considerable research effort has been devoted to understanding this cleavage technique in (100) silicon but several fundamental...[Show more]
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