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Laser Welding for Processing of Thin Crystalline Si Wafers

Ernst, Marco; Steckenreiter, Verena; Kajari-Schroder, Sarah; Brendel, Rolf


Thin crystalline Si films (<100 μm) are used in many applications, such as sensors, photovoltaic absorbers, and optical and particle filters. Such thin crystalline Si films are difficult to handle and break easily under standard semiconductor processing. This paper presents a laser-welding process for the mechanical connection of a thin Si film with a separate stabilizing frame that is also made of crystalline Si. We measure the tear-off stresses to be in the range of 17-50 kPa. The supported...[Show more]

CollectionsANU Research Publications
Date published: 2015
Type: Journal article
Source: IEEE Journal of Photovoltaics
DOI: 10.1109/JPHOTOV.2015.2449652


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