Enhancement of thin metallic film adhesion following vacuum ultraviolet irradiation
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Mitchell, I. V.
Nyberg, G.
Elliman, R. G.
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Abstract
The adhesion of thin metallic films to silicon substrates is shown to improve following irradiation with a flux of either 21.2-eV (He I) 10.2-eV (H Lyman α) photons. The improved adhesion is similar to that found following MeV energy ion irradiation and keV energy electron irradiation, adding support to the view that electronic excitation and/or ionization and precursors to the stronger bonding configuration.
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Applied Physics Letters
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